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Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

By: Lau, John H.
Contributor(s): Lee, S. W. Ricky.
Material type: materialTypeLabelBookPublisher: New York : McGraw-Hill, c2001Description: xxiii, 565 p. : ill. ; 24 cm.ISBN: 0071363270.Subject(s): Microelectronic packaging | Integrated circuits -- Design and construction -- Cost control | Semiconductors -- Junctions | Printed circuitsDDC classification: 621.381046 Online resources: Contributor biographical information | Table of contents | Publisher description
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Item type Current location Call number Copy number Status Date due Barcode Item holds
Books Books Central Library, KUET
General Stacks
621.381046 LAU (Browse shelf) 1 Available 3010032505
Total holds: 0

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