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Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

By: Contributor(s): Material type: TextTextPublication details: New York : McGraw-Hill, c2001.Description: xxiii, 565 p. : ill. ; 24 cmISBN:
  • 0071363270
Subject(s): DDC classification:
  • 621.381046 21
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Item type Current library Call number Copy number Status Date due Barcode Item holds
Books Books Central Library, KUET General Stacks 621.381046 LAU (Browse shelf(Opens below)) 1 Available 3010032505
Total holds: 0

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Khulna University of Engineering & Technology

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