Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

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Material type: Text

TextPublication details: New York : McGraw-Hill, c2001.Description: xxiii, 565 p. : ill. ; 24 cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode	Item holds
Books	Central Library, KUET General Stacks	621.381046 LAU (Browse shelf(Opens below))	1	Available		3010032505

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