000			08252cam a2201021Ka 4500
001			ocn759207687
003			OCoLC
005			20171224113735.0
006			m o d
007			cr cnu---unuuu
008			111101s2012 njua ob 001 0 eng d
010			_z 2011024789
040			_aN$T _beng _epn _cN$T _dE7B _dCDX _dEBLCP _dMERUC _dCOO _dB24X7 _dOCLCQ _dDEBSZ _dOCLCQ _dDEBBG _dOCLCQ _dALSTP _dDG1 _dYDXCP _dMYG _dOCLCF _dOCLCQ _dNLGGC _dIDEBK _dUKDOC _dCN3GA _dOCLCQ _dAZK _dLOA
019			_a757511588 _a759159289 _a794260297 _a808669764 _a816863398 _a961618692 _a962710010 _a966255463
020			_a9781118094303 _q(electronic bk.)
020			_a1118094301 _q(electronic bk.)
020			_a111809316X _q(ebk)
020			_a9781118093160 _q(ebk)
020			_a1118093178 _q(ebk)
020			_a9781118093177 _q(ebk)
020			_a1118093186 _q(ebk)
020			_a9781118093184 _q(ebk)
020			_a1118094298 _q(ebk)
020			_a9781118094297 _q(ebk)
020			_a1118094530 _q(ebk)
020			_a9781118094532 _q(ebk)
020			_a1283268159
020			_a9781283268158
020			_z9780470627693
020			_z0470627697
020			_z9781118093184
020			_z9781118093160
020			_z9781118093177
020			_z9781118094297
020			_z9781118094532
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035			_a(OCoLC)759207687 _z(OCoLC)757511588 _z(OCoLC)759159289 _z(OCoLC)794260297 _z(OCoLC)808669764 _z(OCoLC)816863398 _z(OCoLC)961618692 _z(OCoLC)962710010 _z(OCoLC)966255463
037			_a10.1002/9781118093184 _bWiley InterScience _nhttp://www3.interscience.wiley.com
050		4	_aTA654.8 _b.B37 2012eb
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082	0	4	_a620.1/1296 _223
049			_aMAIN
100	1		_aBarron, Randall F.
245	1	0	_aDesign for thermal stresses / _cRandall F. Barron, Brian R. Barron.
260			_aHoboken, N.J. : _bWiley, _c©2012.
300			_a1 online resource (xviii, 510 pages) : _billustrations.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
490	0		_aEngineering case studies online
504			_aIncludes bibliographical references and index.
520			_a"This resource presents accessible coverage for designers of equipment that focuses on the basics through advanced design techniques for thermal stresses. Various numerical and analytical design approaches are introduced for thermal stresses, and example problems are included to illustrate the application of the principles for practicing engineers and students. Numerous problems and exercises further reinforce the coverage"--Provided by publisher.
500			_aMachine generated contents note: Preface. Nomenclature. Chapter 1. Introduction. 1.1 Definition of Thermal Stress. 1.2 Thermal-Mechanical Design. 1.3 Factor of Safety in Design. 1.4 Thermal Expansion Coefficient. 1.5 Young's Modulus. 1.6 Poisson's Ratio. 1.7 Other Elastic Moduli. 1.8 Thermal Diffusivity. 1.9 Thermal Shock Parameters. 1.10 Historical Note. Chapter 2. Thermal Stresses in Bars. 2.1 Stress and Strain. 2.2 Bar Between Two Supports. 2.3 Bars in Parallel. 2.4 Bars With Partial Removal of Constraints. 2.5 Non-uniform Temperature Distribution. 2.6 Historical Note. Chapter 3. Thermal Bending. 3.1 Limits on the analysis. 3.2 Stress relationships. 3.3 Displacement relations. 3.4 General thermal bending relations. 3.5 Shear bending examples. 3.6 Beam bending examples. 3.7 Thermal Bowing of Pipes. 3.8 Historical Note. 4. Thermal Stresses in Trusses and Frames. 4.1 Elastic Energy Method. 4.2 Unit Load Method. 4.3 Trusses With External Constraints. 4.4 Trusses With Internal Constraints. 4.5 The Finite Element Method. 4.6 Elastic Energy in Bending. 4.7 Pipe Thermal Expansion Loops. 4.8 Pipe Bends. 4.9 Elastic Energy in Torsion. 4.10 Historical Note. 5. Basic Equations of Thermoelasticity. 5.1 Introduction. 5.2 Strain Relationships. 5.3 Stress Relationships. 5.4 Stress-Strain Relations. 5.5 Temperature Field Equation. 5.6 Reduction of the Governing Equations. 5.7 Historical Note. Chapter 6. Plane Stress. 6.1 Introduction. 6.2 Stress Resultants. 6.3 Circular Plate With a Hot Spot. 6.4 Two-Dimensional Problems. 6.5 Plate With a Circular Hole. 6.6 Finite Element Solution for Plane Strain Problems. 6.7 Historical Note. Chapter 7. Bending Thermal Stresses in Plates. 7.1 Introduction. 7.2 Governing Equations for Bending of Rectangular Plates. 7.3 Boundary Conditions For Plate Bending. 7.4 Bending of Simply-Supported Rectangular Plates. 7.5 Rectangular Plates With Two-Dimensional Temperature Distributions. 7.6 Axisymmetrical Bending of Circular Plates. 7.7 Axisymmetric Thermal Bending Examples. 7.8 Circular Plates With a Two-Dimensional Temperature Distribution. 7.9 Historical Note. Chapter 8. Thermal Stresses in Shells. 8.1 Introduction. 8.2 Cylindrical Shells with Axisymmetrical Loading. 8.3 Cooldown of Ring-Shiffened Cylindrical Vessels. 8.4 Cylindrical Vessels with Axial Temperature Variation. 8.5 Short Cylinders. 8.6 Axisymmetrical Loading of Spherical Shells. 8.7 Approximate Analysis of Spherical Shells Under Axisymmetric Loading. 8.8 Historical Note. Chapter 9. Thermal Stresses in Thick-Walled Vessels. 9.1 Introduction. 9.2 Governing Equations for Plane Strain. 9.3 Hollow Cylinder with Steady-state Heat Transfer. 9.4 Solid Cylinder. 9.5 Thick-walled Spherical Vessels. 9.6 Solid Spheres. 9.7 Historical Note. Chapter 10. Thermoelastic Stability. 10.1 Introduction. 10.2 Thermal Buckling of Columns. 10.3 General Formulation for Beam-Columns. 10.4 Post-buckling Behavior of Columns. 10.5 Lateral Thermal Buckling of Beams. 10.6 Symmetrical Buckling of Circular Plates. 10.7 Thermal Buckling of Rectangular Shells. 10.8 Thermal Buckling of Cylindrical Shells. 10.9 Historical Note. Appendix A. Preferred prefixes in the SI system of units. Appendix B. Properties of material at 300 K. Appendix C. Properties of selected materials as a function of temperature. Appendix D. Bessel Functions. Appendix E. Kelvin Functions. Appendix F. Matrices and determinants.
588	0		_aPrint version record.
505	0		_aDesign for Thermalstresses; Contents; Preface; Nomenclature; 1 Introduction; 1.1 Definition of Thermal Stress; 1.2 Thermal-Mechanical Design; 1.3 Factor of Safety in Design; 1.4 Thermal Expansion Coefficient; 1.5 Young's Modulus; 1.6 Poisson's Ratio; 1.7 Other Elastic Moduli; 1.8 Thermal Diffusivity; 1.9 Thermal Shock Parameters; 1.10 Historical Note; Problems; References; 2 Thermal Stresses in Bars; 2.1 Stress and Strain; 2.2 Bar between Two Supports; 2.3 Bars in Parallel; 2.4 Bars with Partial Removal of Constraints; 2.5 Nonuniform Temperature Distribution; 2.6 Historical Note; Problems.
546			_aThis edition in English.
650		0	_aThermal stresses.
650		7	_aSCIENCE _xMechanics _xDynamics _xThermodynamics. _2bisacsh
650		7	_aSCIENCE _xNanoscience. _2bisacsh
650		7	_aThermal stresses. _2fast _0(OCoLC)fst01149790
655		4	_aElectronic books.
655		7	_aElectronic books. _2local
700	1		_aBarron, Brian R.
776	0	8	_iPrint version: _aBarron, Randall F. _tDesign for thermal stresses. _dHoboken, N.J. : Wiley, ©2012 _z9780470627693 _w(DLC) 2011024789 _w(OCoLC)724644502
856	4	0	_uhttp://onlinelibrary.wiley.com/book/10.1002/9781118093184 _zWiley Online Library
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