| 000 | 05170cam a2200841Ka 4500 | ||
|---|---|---|---|
| 001 | ocn778448543 | ||
| 003 | OCoLC | ||
| 005 | 20171224113843.0 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 120228s2012 nju ob 001 0 eng d | ||
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_a9781119963240 _q(electronic bk.) |
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| 020 |
_a9781119963677 _q(electronic bk.) |
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_a1119963672 _q(electronic bk.) |
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| 020 | _a1280590807 | ||
| 020 | _a9781280590801 | ||
| 020 | _z9780470662540 | ||
| 020 | _z0470662549 | ||
| 024 | 8 | _a9786613620637 | |
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_a(OCoLC)778448543 _z(OCoLC)779617142 _z(OCoLC)817082211 _z(OCoLC)819896613 |
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| 037 |
_a10.1002/9781119963677 _bWiley InterScience _nhttp://www3.interscience.wiley.com |
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_aTK7874.53 _b.A39 2012eb |
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_a621.39/5 _223 |
| 049 | _aMAIN | ||
| 245 | 0 | 0 |
_aAdvanced interconnects for ULSI technology / _c[edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech. |
| 260 |
_aHoboken, NJ : _bWiley, _c2012. |
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| 300 | _a1 online resource | ||
| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 520 |
_a"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- _cProvided by publisher. |
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| 504 | _aIncludes bibliographical references and index. | ||
| 588 | 0 | _aPrint version record. | |
| 505 | 0 | _aFront Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index. | |
| 650 | 0 | _aInterconnects (Integrated circuit technology) | |
| 650 | 0 |
_aIntegrated circuits _xUltra large scale integration. |
|
| 650 | 4 |
_aIntegrated circuits _xUltra large scale integration. |
|
| 650 | 4 | _aInterconnects (Integrated circuit technology) | |
| 650 | 7 |
_aTECHNOLOGY & ENGINEERING _xElectronics _xCircuits _xVLSI & ULSI. _2bisacsh |
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| 650 | 7 |
_aCOMPUTERS _xLogic Design. _2bisacsh |
|
| 650 | 7 |
_aTECHNOLOGY & ENGINEERING _xElectronics _xCircuits _xLogic. _2bisacsh |
|
| 650 | 7 |
_aIntegrated circuits _xUltra large scale integration. _2fast _0(OCoLC)fst00975596 |
|
| 650 | 7 |
_aInterconnects (Integrated circuit technology) _2fast _0(OCoLC)fst00976051 |
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| 655 | 4 | _aElectronic books. | |
| 700 | 1 | _aBaklanov, Mikhail. | |
| 700 | 1 | _aHo, P. S. | |
| 700 | 1 | _aZschech, Ehrenfried. | |
| 773 | 0 | _tEBL | |
| 776 | 0 | 8 |
_iPrint version: _tAdvanced interconnects for ULSI technology. _dHoboken, NJ : Wiley, 2012 _z9780470662540 _w(DLC) 2011038787 _w(OCoLC)757478544 |
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_uhttp://onlinelibrary.wiley.com/book/10.1002/9781119963677 _zWiley Online Library |
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